posted on Jun, 9 2008 @ 05:26 PM
Years ago, I worked as an electronics technician and used a hot air gun
various sized nozzle tip to remove the surface mounted chips and components.
But these things give off too much heat and will burn off the traces and warp boards if not done correctly.
You should get some solder wick and place it between the soldering iron tip and the soldered components.
This will suckup the solder like a sponge, then just gently flick it off the component.
You may have to lift the pins of stubborn IC's one by one with a needle tip as you heat each pin. Once all the pins have been lifter, you can twist
off the IC from the PCB, but make sure all pins have been lifted or else you'll lift the copper traces too.