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This technology will be great.
This could solve BGA(ball graph array) problems, PS5 will have this tech if it does solve it and the next Xbox what ever they will call it I don't know, they kinda muddled it up.
BGA chips on PCB BGA pads are prone to failure after overheating, after the heat becomes to much and liquefies the solder spheres under the BGA chip. After awhile time over time there is usually 1 - 10est connections from the BGA not making contact with PCB BGA pads, there for making a device not function as intended switching it into error mode.
Not at all.
First off, it's ball grid array. Second, when you reflow the thing onto the board to begin with, you intentionally melt the balls so that they form a solder joint under there. The chip cannot possibly become hot enough in normal operation (short of catastrophic failure) to reflow the balls again.
Heat stress can cause badly reflowed BGA balls to crack loose if you've got really crappy joints and/or badly matched TCA between the chip's substrate and the PCB. But not if it's done right.
Finally, this technology won't do squat for chip mounting technology anyway. The 2D tin technique is applicable to interconnections on the silicon itself. Not the packaging and external connections.
eta: we use BGA and QFN on every military and aerospace design we do. It holds up to insane temp ranges and G forces if done right.edit on 24-11-2013 by Bedlam because: (no reason given)
May I ask how big the solder spheres are they use in satelites and military are?
what ratio are the spheres like tin 80%, lead 20% blah blah kinda hoo haa?